- Business areas
- +86-371-63379559
- info@sinocrystal.com.cn
- Building 30#, No. 20 Bitao Road, High and New Technology Development Zone, Zhengzhou
Micrometer wire of diamond 310-350 (silicon wafer cutting and root)
1. Diamond is well- packaged; sharpness is good.
2. Cutting speed is fast, capacity is high with low cost.
3. Advanced and stable technique with high precision of cutting.
4. Low cost of operation.